Indima yeWhite Corundum Micropowder kwiZixhobo zoPakisho ze-elektroniki
Oogxa bam, abo basebenza kwizinto zokupakisha bayazi ukuba nangona ukupakisha nge-elektroniki kuvakala kumangalisa, eneneni konke kuxhomekeke kwiinkcukacha. Kufana nokubeka isuti yokukhusela kwitshiphusi exabisekileyo. Le suti kufuneka imelane nokuchaphazeleka (amandla oomatshini), ikhuphe ubushushu (ukuqhuba kobushushu), kwaye inike ukugquma kunye nokumelana nokufuma. Iziphene kuyo nayiphi na kwezi zibalulekile. Namhlanje, siza kugxila kwisixhobo esisetyenziswa rhoqo, kodwa esintsonkothileyo—i-white corundum micropowder—ukuze sihlolisise indlela esi sithako sincinci esidlala ngayo indima ebalulekileyo kule suti yokukhusela.
Ⅰ. Masiqale simazi umlinganiswa ophambili: “iqhawe elimhlophe” elinobunyulu obuphezulu.
I-corundum emhlophe, ukuyibeka ngokulula, yi-aluminium oxide ecocekileyo kakhulu (Al₂O₃). Inxulumene ne-brown corundum eqhelekileyo, kodwa imvelaphi yayo icocekile ngakumbi. Ubumsulwa bayo obukhethekileyo buyinika umbala omhlophe, ubulukhuni obuphezulu, ukumelana nobushushu obuphezulu, kunye neempawu zeekhemikhali ezizinzileyo kakhulu, nto leyo eyenza ukuba ingachaphazeleki nayinye into.
Ukuyigaya ibe yi-micron okanye i-nanometer-scale fine powder yinto esiyibiza ngokuba yi-umgubo omhlophe we-corundum. Musa ukuyithatha lula le mpuphu. Kwizinto zokupakisha ze-elektroniki, ingakumbi ii-epoxy molding compounds (EMC) okanye izinto zokupakisha ze-ceramic, ayisiyongezo nje; sisizalisi sepillar.
II. Yintoni kanye kanye eyenzayo kwiphakheji?
Cinga ngezinto zokupakisha njengesiqwenga "sesamente esidityanisiweyo," i-resin iyi-"glue" ethambileyo nenamathelayo ebamba yonke into kunye. Kodwa iglu yodwa ayanelanga; ithambile kakhulu, ibuthathaka, kwaye iyaphuka xa ishushu. Kulapho umgubo omhlophe we-corundum ungena khona. Kufana "namaqhekeza" kunye "nesanti" eyongezwe kwisamente, iphakamisa kakhulu ukusebenza kwale "samente" ukuya kwinqanaba elitsha.
Ngokuyintloko: "Itshaneli yokuhambisa ubushushu" esebenzayo
Itshiphusi ifana nesithando somlilo esincinci. Ukuba ubushushu abunakucinywa, bunokukhokelela ekuqhumeni rhoqo nasekuyekeni, okanye nasekutshisweni ngokupheleleyo. I-resin ngokwayo ayisebenzi kakuhle ekufudumaleni, ibamba ubushushu ngaphakathi—imeko engathandekiyo ngokwenene.
Umgubo omncinci we-corundum omhlopheinomoya wokushisa ophezulu kakhulu kune-resin. Xa inani elikhulu le-micropowder lisasazwa ngokulinganayo kwi-resin, lidala inethiwekhi yee-"highways" ezincinci ezingenakubalwa. Ubushushu obuveliswa yi-chip buqhutywa ngokukhawuleza ukusuka ngaphakathi ukuya kumphezulu wephakheji ngezi nxalenye ze-corundum ezimhlophe, emva koko busasazeka emoyeni okanye kwisinki yobushushu. Okukhona umgubo wongezwa kwaye okukhona uhambelana kakuhle nobukhulu be-particle, kokukhona umbane wobushushu uba mkhulu kwaye umanzi ngakumbi, kwaye kokukhona umbane wobushushu (TC) uphezulu wezinto zokupakisha. Izixhobo eziphezulu ngoku zilwela ukuqhuba okuphezulu kobushushu, kwaye i-white corundum micropowder idlala indima ephambili koku.
Izakhono Ezikhethekileyo: "Umlawuli Wokwandiswa Kobushushu" Ochanekileyo
Lo ngumsebenzi obalulekileyo! Itshiphu (ngesiqhelo i-silicon), izinto zokupakisha, kunye ne-substrate (njenge-PCB) zonke zine-coefficients ezahlukeneyo zokwandiswa kobushushu (CTE). Ngamafutshane, xa zishushu, ziyanda kwaye zinciphe ukuya kumanqanaba ahlukeneyo. Ukuba amazinga okwanda kunye nokuncipha kwezinto zokupakisha ahluke kakhulu kulawo etshiphu, ukutshintshatshintsha kobushushu, amaqondo obushushu atshintshanayo kunye nashushu, kuya kuvelisa uxinzelelo olukhulu lwangaphakathi. Oku kufana nabantu abaninzi abatsala isiqwenga sempahla kumacala ahlukeneyo. Ekuhambeni kwexesha, oku kunokubangela ukuba itshiphu iqhekeke okanye amalungu e-solder angasebenzi. Oku kubizwa ngokuba "kukusilela kwe-thermomechanical."
Umgubo omhlophe we-corundum ine-coefficient yokwandisa ubushushu ephantsi kakhulu kwaye izinzile kakhulu. Ukuyifaka kwi-resin kunciphisa ngempumelelo i-coefficient yokwandisa ubushushu bezinto ezidityanisiweyo zonke, ihambelana ngokusondeleyo ne-silicon chip kunye ne-substrate. Oku kuqinisekisa ukuba izinto ziyanda kwaye zincipha ngaxeshanye ngexesha lokutshintsha kobushushu, kunciphisa kakhulu uxinzelelo lwangaphakathi kwaye kuphucula ngokwendalo ukuthembeka kwesixhobo kunye nobomi baso. Oku kufana neqela: kuphela xa besebenzisana kunye apho banokufeza khona into ethile.
Izakhono Ezisisiseko: “Isiqinisi Samathambo” Esinamandla
Emva kokunyibilika, i-resin ecocekileyo inamandla aqhelekileyo oomatshini, ubulukhuni, kunye nokumelana nokuguguleka. Ukongeza umgubo we-corundum omhlophe oqinileyo kunye nowomeleleyo kufana nokufaka izigidigidi "zamathambo" aqinileyo kwi-resin ethambileyo. Oku kuzisa ngokuthe ngqo iingenelo ezintathu eziphambili:
Ukwanda kwemodulus: Le nto iqinile ngakumbi kwaye ayichaphazeleki lula, nto leyo ekhusela ngcono iingcingo zangaphakathi zetship kunye negolide.
Amandla anyukileyo: Amandla okugoba kunye nokuxinana ayandiswa, nto leyo eyivumela ukuba imelane noxinzelelo lwangaphandle loomatshini.
Ukumelana nokurhawuzelelwa nokufuma: Umphezulu wephakheji uqinile kwaye awugugi. Ngaphezu koko, ukuzaliswa okuxineneyo kunciphisa indlela yokungena komswakama, nto leyo ephucula ukumelana nokufuma.
Ⅲ. Yongeza nje? Ulawulo lomgangatho lubalulekile!
Okwangoku, unokucinga ukuba kulula—yongeza nje umgubo omninzi kangangoko unako kwi-resin. Kaloku, kulapho ubuchule bokwenyani bukhoyo. Uhlobo lomgubo omawufakwe kunye nendlela yokuwufaka zinzima kakhulu.
Ucoceko yeyona nto iphambili: Udidi lwe-elektroniki kunye nodidi oluqhelekileyo lwe-abrasive zizinto ezimbini ezahlukeneyo. Ngokukodwa, umxholo wokungcola kwesinyithi okufana ne-potassium (K) kunye ne-sodium (Na) kufuneka kulawulwe ukuya kumanqanaba aphantsi kakhulu e-ppm. Olu kungcola lunokufuduka kwiindawo zombane nakwiindawo ezifumileyo, okubangela ukuvuza kwesekethe okanye iisekethe ezimfutshane, nto leyo esongela kakhulu ukuthembeka. "Umhlophe" awungombala nje kuphela; ufuzisela ubumsulwa. Ubungakanani bamasuntswana kunye nokuhlelwa komgangatho luhlobo lobugcisa: Khawuthelekelele ukuba zonke iisphere bezinobukhulu obufanayo, bekuya kubakho izithuba phakathi kwazo. Kufuneka "sibeke" ii-micropowders zobukhulu obahlukeneyo ukuze iisphere ezincinci zizalise izithuba phakathi kweesphere ezinkulu, zifezekise uxinano oluphezulu lokupakisha. Uxinano oluphezulu lokupakisha lubonelela ngeendlela zokuqhuba ubushushu ngakumbi kunye nolawulo olungcono lwe-coefficient yokwandiswa kobushushu. Kwangaxeshanye, ubungakanani bamasuntswana akufuneki bube bukhulu kakhulu, nto leyo eya kuchaphazela ukugeleza kokucubungula kunye nokugqitywa komphezulu; okanye bube buncinci kakhulu, njengoko oku kuya kudala indawo enkulu yomphezulu kwaye kuvumele ukufunxwa kwe-resin ngokugqithisileyo, ukunciphisa izinga lokuzalisa kunye nokunyusa iindleko. Ukuyila olu sasazo lobungakanani bamasuntswana yenye yeemfihlo eziphambili zefomyula nganye.
Ukwakheka kunye nonyango lomphezulu zibalulekile: Ukuma kwamasuntswana kufanele kube yinto eqhelekileyo, elinganayo, kunye neekona ezimbalwa ezibukhali. Oku kuqinisekisa ukuhamba kakuhle kwe-resin kwaye kunciphisa uxinzelelo. Unyango lomphezulu lubaluleke ngakumbi.I-corundum emhlopheithanda amanzi, ngelixa i-resin ithanda amanzi, nto leyo eyenza ukuba zingahambelani ngokwemvelo. Ke ngoko, umphezulu we-micropowder kufuneka ugqunywe nge-silane coupling agent, nto leyo eyenza ukuba ibe "yi-organic coupling." Ngale ndlela, i-powder ingadityaniswa ngokusondeleyo ne-resin, kuthintelwe ukuba i-interface ibe yindawo ebuthathaka ebangela ukuqhekeka xa ivezwa kumswakama okanye kuxinzelelo.