Idayimani micropowder luhlobo lwe-ultrafine abrasive enobunzima obuphezulu kakhulu kunye nokumelana nokunxiba.Ukusetyenziswa kwayo kubanzi kakhulu kwaye kubaluleke kakhulu, kubonakaliswa ikakhulu kule miba ilandelayo:
1. Ukuchanekaukucola nokupholisha: Umgubo wedayimane uye waba yinto eyimfuneko ekuqhubeni ngokuchanekileyo ngenxa yobunzima bayo obuphezulu kakhulu kunye nokunganyangeki. Kwi-optical, i-elektroniki, i-semiconductor kunye namanye amashishini, isetyenziselwa ukupolisha iilensi ezibonakalayo, ii-silicon wafers, ii-wafers ze-ceramic kunye nezinye izinto ezichanekileyo eziphezulu, ezinokufikelela ekugqityweni okuphezulu kakhulu kunye neemfuno ezichanekileyo. Ukongeza, isetyenziswa ngokuqhelekileyo ekusileni izinto ezinzima kakhulu, ezifana ne-cemented carbide, i-ceramics, i-gemstones njalo njalo.
2. Ukwenziwa nokulungiswa kokungunda: Kwishishini lokungunda,idayimani micropowderisetyenziselwa ukusetyenzwa okuchanekileyo kunye nokulungiswa kokungunda. Ngokusila i-ultrafine ye-powder micro, iziphene ezincinci kumphezulu wesikhunta zingalungiswa, kwaye ukuchaneka kunye nobomi benkonzo ye-mold bunokuphuculwa. Ngeli xesha, i-micropowder yedayimane inokusetyenziselwa ukwenza iindawo zokungunda ezichanekileyo, ezinje nge-mold cores.
3. Ukwenziwa kwezixhobo zokusika: umgubo wedayimani yinto ebalulekileyo ekrwada kwimvelisoamavili okugaya idayimani, ii-reamers, ii-milling cutters kunye nezinye izixhobo zokusika. Ezi zixhobo zinobuchule obuphezulu bokusika kunye nokuchaneka ekuqhubeni izinto ezinzima, kwaye zisetyenziswa ngokubanzi kwi-machining, ukulungiswa kwamatye, ukuhlola i-geological kunye nezinye iindawo.
Ukwandiswa kwezinto ezihlanganisiweyo:Diamond micropowderinokongezwa kwizinto ezidibeneyo njengezinto eziphuculweyo zokuphucula ukuqina, ukumelana nokunxiba kunye nokuzinza kwe-thermal yezinto ezidibeneyo. Ndwendwela iwebhusayithi yeendaba ukuze ufumane okungakumbiiindaba zobuchwepheshe.
Idayimani micropowder luhlobo lwe-ultrafine abrasive enobunzima obuphezulu kakhulu kunye nokumelana nokunxiba.
Ixesha lokuposa: Sep-03-2024